Invention Grant
- Patent Title: Substrate bonding apparatus and substrate bonding method
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Application No.: US16144439Application Date: 2018-09-27
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Publication No.: US10424557B2Publication Date: 2019-09-24
- Inventor: Isao Sugaya , Hajime Mitsuishi , Minoru Fukuda
- Applicant: NIKON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NIKON CORPORATION
- Current Assignee: NIKON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garett & Dunner, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/18 ; H01L23/544 ; H01L21/66 ; H01L21/02 ; H01L21/20 ; H01L21/67 ; H01L21/687 ; H01L21/68
Abstract:
A substrate bonding apparatus that brings a part of a surface of a first substrate and a part of a surface of a second substrate into contact to form contact regions at the parts, and then enlarges the contact regions to bond the first substrate and the second substrate includes: a temperature adjusting unit that adjusts a temperature of at least one of the first substrate and the second substrate such that positional misalignment between the first substrate and the second substrate does not exceed a threshold at least in a course of enlargement of the contact regions.
Public/Granted literature
- US20190043826A1 SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD Public/Granted day:2019-02-07
Information query
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