Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16026530Application Date: 2018-07-03
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Publication No.: US10424582B2Publication Date: 2019-09-24
- Inventor: Toshihiko Saito
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2010-035435 20100219
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L27/105 ; H01L27/12 ; H01L27/088 ; H01L29/786 ; H01L27/11524 ; H01L29/06 ; H01L29/24 ; H01L29/423 ; H01L29/788

Abstract:
At least one of a plurality of transistors which are highly integrated in an element is provided with a back gate without increasing the number of manufacturing steps. In an element including a plurality of transistors which are longitudinally stacked, at least a transistor in an upper portion includes a metal oxide having semiconductor characteristics, a same layer as a gate electrode of a transistor in a lower portion is provided to overlap with a channel formation region of the transistor in an upper portion, and part of the same layer as the gate electrode functions as a back gate of the transistor in an upper portion. The transistor in a lower portion which is covered with an insulating layer is subjected to planarization treatment, whereby the gate electrode is exposed and connected to a layer functioning as source and drain electrodes of the transistor in an upper portion.
Public/Granted literature
- US20190013318A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-01-10
Information query
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