Invention Grant
- Patent Title: Three-dimensional non-volatile memory and manufacturing method thereof
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Application No.: US15866132Application Date: 2018-01-09
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Publication No.: US10424593B2Publication Date: 2019-09-24
- Inventor: I-Ting Lin , Yuan-Chieh Chiu , Hong-Ji Lee
- Applicant: MACRONIX International Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX International Co., Ltd.
- Current Assignee: MACRONIX International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: H01L27/11578
- IPC: H01L27/11578 ; G11C14/00 ; G11C16/04 ; H01L21/28 ; H01L27/1157 ; G11C16/34 ; G11C11/56

Abstract:
A three-dimensional non-volatile memory and a method of manufacturing the same are provided. The three-dimensional non-volatile memory includes a substrate, a charge storage structure, a stacked structure and a channel layer. The charge storage structure is disposed on the substrate. The stacked structure is disposed at a side of the charge storage structure and includes insulating layers, gates, a buffer layer and a barrier layer. The insulating layers and the gates are alternately stacked. The buffer layer is disposed between each of the gates and the charge storage structure and on the surfaces of the insulating layers. The barrier layer is disposed between each of the gates and the buffer layer. An end of the gate is convex with respect to an end of the barrier layer in a direction away from the channel layer.
Public/Granted literature
- US20190214402A1 THREE-DIMENSIONAL NON-VOLATILE MEMORY AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-07-11
Information query
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