Invention Grant
- Patent Title: Semiconductor structure
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Application No.: US15895430Application Date: 2018-02-13
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Publication No.: US10424599B2Publication Date: 2019-09-24
- Inventor: Ji Quan Liu , Chun Lei Gong
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai CN Beijing
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201610134339 20160309
- Main IPC: H01L27/01
- IPC: H01L27/01 ; H01L31/0392 ; H01L27/12 ; H01L21/762 ; H01L29/66 ; H01L29/78 ; H01L29/786 ; H01L21/84 ; H01L21/8234

Abstract:
Semiconductor structures are provided. A semiconductor structure includes a bottom substrate having a first region and a second region; an insulation layer formed on the bottom substrate in the first region; a top substrate on side surface of the trench and the insulation layer; a first fin portion formed over the insulation layer, and a gate structure crossing the first fin portion. The first fin portion is electrically isolated from the bottom substrate through the insulation layer to reduce the leakage current at the bottom of the first fin portion. The gate structure covers part of side and top surfaces of the first fin portion.
Public/Granted literature
- US20180175068A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2018-06-21
Information query
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