Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16214197Application Date: 2018-12-10
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Publication No.: US10424676B2Publication Date: 2019-09-24
- Inventor: Shinya Sasagawa , Motomu Kurata , Satoru Okamoto , Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2015-136617 20150708; JP2015-172660 20150902
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L21/3213 ; H01L29/786

Abstract:
A minute transistor is provided. A transistor with small parasitic capacitance is provided. A transistor with high frequency characteristics is provided. A semiconductor device including the transistor is provided. A semiconductor device includes an oxide semiconductor, a first conductor and a second insulator embedded in a first insulator, a second conductor and a third conductor. Edges of the second conductor and the third conductor facing each other each has a taper angle of 30 degree or more and 90 degree or less.
Public/Granted literature
- US20190115478A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-04-18
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