Invention Grant
- Patent Title: Light-emitting device package
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Application No.: US15744698Application Date: 2016-07-18
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Publication No.: US10424704B2Publication Date: 2019-09-24
- Inventor: Dong Hyun Yu , Bong Kul Min
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2015-0100967 20150716
- International Application: PCT/KR2016/007773 WO 20160718
- International Announcement: WO2017/010851 WO 20170119
- Main IPC: H01L33/36
- IPC: H01L33/36 ; H01L33/52 ; H01L33/64 ; H01L33/62 ; H01L33/54 ; H01L33/60 ; H01L25/16 ; H01L33/48

Abstract:
A light-emitting device package according to an embodiment includes first and second lead frames, a package body exposing a portion of a front surface of at least one of the first or second lead frame, a light-emitting device, a protecting device, and at least one wire configured to electrically connect the exposed front surface of at least one of the first or second lead frame to at least one of the light-emitting device or the protecting device, wherein the exposed front surface of at least one of the first or second lead frame includes at least one bonding area connected to the at least one wire, wherein the at least one bonding area has a planar shape in which the at least one bonding area is disposed so as to contact a corner of the exposed front surface of at least one of the first or second lead frame.
Public/Granted literature
- US20180212117A1 LIGHT-EMITTING DEVICE PACKAGE Public/Granted day:2018-07-26
Information query
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