An LED flip chip die-bond conductive adhesive structure includes an LED flip chip and an electronic circuit board. An LED flip chip negative electrode, an LED flip chip nonmetallic region and an LED flip chip positive electrode are sequentially arranged on a lower surface of the LED flip chip from left to right; a circuit board negative electrode, a circuit board nonmetallic region and a circuit board positive electrode are sequentially arranged on an upper surface of the electronic circuit board from left to right. The LED flip chip and the electronic circuit board are fixedly connected through a thermosetting die-bond insulating adhesive bonded between the LED flip chip nonmetallic region and the circuit board nonmetallic region; and the LED flip chip positive and negative electrodes are respectively conductively connected with the circuit board positive and negative electrodes in a direct metal-metal contact manner.