- Patent Title: Interconnect structure and method for on-chip information transfer
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Application No.: US15820627Application Date: 2017-11-22
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Publication No.: US10424733B2Publication Date: 2019-09-24
- Inventor: Wei Du , Tao Wang , Christian Albertus Nijhuis
- Applicant: NATIONAL UNIVERSITY OF SINGAPORE
- Applicant Address: SG Singapore
- Assignee: NATIONAL UNIVERSITY OF SINGAPORE
- Current Assignee: NATIONAL UNIVERSITY OF SINGAPORE
- Current Assignee Address: SG Singapore
- Agency: Volpe and Koenig, P.C.
- Priority: SG10201609935Y 20161125
- Main IPC: H01L49/00
- IPC: H01L49/00 ; G02B6/122 ; H01L23/52 ; H01L23/66 ; H01L49/02
Abstract:
An interconnect structure for on-chip information transfer, and a method for on-chip information transfer. The interconnect structure comprises a source configured for electrically generating plasmons; a detector configured for electrically detecting the generated plasmons; and a plasmonic waveguide coupled between the source and the detector.
Public/Granted literature
- US20180151802A1 INTERCONNECT STRUCTURE AND METHOD FOR ON-CHIP INFORMATION TRANSFER Public/Granted day:2018-05-31
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