A headphone wire includes a plurality of inner cores each having a conductor and enamel coating layer covered on the conductor so as to provide an insulation effect. The inner cores are covered with an insulating skin and interwoven together inside it; one end of the inner cores is penetrated out of the insulating skin to form an electroplating end, on which a tin plated portion is electroplated; and a connecting terminal is riveted onto the tin plated portion. Whereby, space can be saved and the flexibility is better because the inner cores are interwoven together, and the riveting is used instead of spot welding connecting, capable of increasing service life and being easy to be assembled and maintained.