A bi-stage temperature device may include a low temperature component, comprising a negative temperature coefficient (NTC) material; and a high temperature component, mechanically coupled to the low temperature component, and comprising a positive temperature coefficient (PTC) material, and a flexible substrate. The low temperature component may be arranged to generate a low temperature transition, the low temperature transition comprising a first change in electrical resistance, from a first resistance to a second resistance at a first temperature. The high temperature component may be arranged to generate a high temperature transition, the high temperature transition comprising a second change in electrical resistance, from a third resistance to a fourth resistance at a second temperature.