Invention Grant
- Patent Title: Acoustic wave device and method of fabricating the same
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Application No.: US15331598Application Date: 2016-10-21
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Publication No.: US10425060B2Publication Date: 2019-09-24
- Inventor: Kentaro Nakamura , Fumiya Matsukura , Takashi Matsuda , Tsutomu Miyashita , Jun Tsutsumi
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2016-002013 20160107
- Main IPC: H03H9/25
- IPC: H03H9/25 ; H03H3/08 ; H03H9/02 ; H03H9/64 ; H03H9/145

Abstract:
An acoustic wave device includes: a piezoelectric substrate; a comb-shaped electrode that is located on the piezoelectric substrate and excites an acoustic wave; and a silicon oxide film that is located on the piezoelectric substrate so as to cover the comb-shaped electrode, and has a total concentration of carbon (C), hydrogen (H), nitrogen (N), and fluorine (F) equal to or less than 3.5 atomic %.
Public/Granted literature
- US20170201232A1 ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2017-07-13
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