Invention Grant
- Patent Title: Elastic wave device, high frequency front-end circuit, and communication apparatus
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Application No.: US15922955Application Date: 2018-03-16
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Publication No.: US10425116B2Publication Date: 2019-09-24
- Inventor: Akira Konno , Masakazu Mimura
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2015-208923 20151023
- Main IPC: H03H3/10
- IPC: H03H3/10 ; H03H9/02 ; H03H9/10 ; H03H9/25 ; H03H9/64 ; H04B1/10 ; H03H9/145 ; H01L41/047

Abstract:
An elastic wave device includes a LiNbO3 substrate, an IDT electrode provided on the LiNbO3 substrate, and a dielectric film that is provided on the LiNbO3 substrate so as to cover the IDT electrode and includes a projection on an upper surface of the stated dielectric film. A main mode of an elastic wave excited by the IDT electrode uses a Rayleigh wave, and a thickness of the IDT electrode is set such that a frequency at which a response by an SH wave appears is lower than a resonant frequency of the Rayleigh wave.
Public/Granted literature
- US20180205403A1 ELASTIC WAVE DEVICE, HIGH FREQUENCY FRONT-END CIRCUIT, AND COMMUNICATION APPARATUS Public/Granted day:2018-07-19
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