Invention Grant
- Patent Title: High-frequency switch module
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Application No.: US15668046Application Date: 2017-08-03
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Publication No.: US10425119B2Publication Date: 2019-09-24
- Inventor: Takanori Uejima
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2015-020844 20150205
- Main IPC: H04B1/48
- IPC: H04B1/48 ; H04B1/00 ; H04B1/50 ; H03H7/46 ; H04B1/403

Abstract:
A high-frequency switch module (10) includes a switch element (20) and LC parallel resonant circuits (31 and 32). The switch element (20) includes selection target terminals (P14 and P21) used to transmit communication signals using different frequencies. The LC parallel resonant circuits (31 and 32) are connected between a connection conductor (901) connected to the selection target terminal (P14) and a connection conductor (902) connected to the selection target terminal (P21). The LC parallel resonant circuits (31 and 32) are connected in series between the connection conductors (901 and 902). The LC parallel resonant circuits (31 and 32) have different attenuation pole frequencies.
Public/Granted literature
- US20170331512A1 HIGH-FREQUENCY SWITCH MODULE Public/Granted day:2017-11-16
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