Invention Grant
- Patent Title: Method for stencil printing during manufacture of printed circuit board
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Application No.: US15075445Application Date: 2016-03-21
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Publication No.: US10426039B2Publication Date: 2019-09-24
- Inventor: Xue-Qin Zhang
- Applicant: Fu Tai Hua Industry (Shenzhen) Co., Ltd. , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: CN201510807431 20151120
- Main IPC: H05K3/40
- IPC: H05K3/40 ; H05K3/12 ; H05K3/00 ; H05K3/24 ; H05K3/42 ; H05K13/08
Abstract:
A method for stencil printing during manufacture of a printed circuit board includes forming a circuit diagram on a trepanned circuit board using a first stencil that has the circuit diagram, a scraper and conductive inks, forming a solder mask layer on the circuit board using a second stencil, the scraper, and solder materials, forming words and marks on the circuit board using a third stencil, the scraper, and inks, and forming a solder paste layer on the circuit board using a fourth stencil, the scraper, and solder paste.
Public/Granted literature
- US20170150610A1 METHOD FOR STENCIL PRINTING DURING MANUFACTURE OF PRINTED CIRCUIT BOARD Public/Granted day:2017-05-25
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