Invention Grant
- Patent Title: Additive layer manufacturing
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Application No.: US14386277Application Date: 2013-03-18
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Publication No.: US10427247B2Publication Date: 2019-10-01
- Inventor: Andrew David Wescott , Jagjit Sidhu
- Applicant: BAE SYSTEMS plc
- Applicant Address: GB London
- Assignee: BAE SYSTEMS plc
- Current Assignee: BAE SYSTEMS plc
- Current Assignee Address: GB London
- Agency: Finch & Maloney PLLC
- Priority: GB1204752.8 20120319
- International Application: PCT/GB2013/050688 WO 20130318
- International Announcement: WO2013/140147 WO 20130926
- Main IPC: B23K26/356
- IPC: B23K26/356 ; B33Y10/00 ; B33Y30/00 ; B23K9/04 ; B22F3/105 ; B23K35/02 ; B23K31/00 ; C21D10/00 ; B23K26/32 ; B23K26/342 ; B23K26/144 ; B23K26/70 ; B23K26/0622 ; B29C64/153 ; B23K103/00

Abstract:
Apparatus and a method for forming a metallic component by additive layer manufacturing are provided. The method includes the steps of using a heat source such as a laser to melt the surface of a work piece and form a weld pool; adding wire or powdered metallic material to the weld pool and moving the heat source relative to the work piece so as to progressively form a new layer of metallic material on the work piece; applying forced cooling to the formed layer; stress relieving the cooled layer by applying a peening step, for example with a pulsed laser, and repeating the above steps as required to form the component layer by layer.
Public/Granted literature
- US20150041025A1 ADDITIVE LAYER MANUFACTURING Public/Granted day:2015-02-12
Information query
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