Invention Grant
- Patent Title: Composition for forming a silica based layer, silica based layer, and electronic device
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Application No.: US14839642Application Date: 2015-08-28
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Publication No.: US10427944B2Publication Date: 2019-10-01
- Inventor: Jun-Young Jang , Taek-Soo Kwak , Woo-Han Kim , Hui-Chan Yun , Jin-Hee Bae , Bo-Sun Kim , Yoong-Hee Na , Sae-Mi Park , Han-Song Lee , Wan-Hee Lim
- Applicant: SAMSUNG SDI CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: Samsung SDI Co., Ltd.
- Current Assignee: Samsung SDI Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: KR10-2014-0184768 20141219
- Main IPC: C01B33/12
- IPC: C01B33/12 ; C09D183/16 ; H01L21/02 ; C08G77/62
Abstract:
A composition for forming a silica based layer, the composition including a silicon-containing polymer having polydispersity ranging from about 3.0 to about 30 and a solvent, and having viscosity ranging from about 1.30 centipoise (cps) to about 1.80 cps at 25° C. Also, a silica based layer is formed of the composition, and an electronic device includes the silica based layer.
Public/Granted literature
- US20160176718A1 COMPOSITION FOR FORMING A SILICA BASED LAYER, SILICA BASED LAYER, AND ELECTRONIC DEVICE Public/Granted day:2016-06-23
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