Invention Grant
- Patent Title: Photosensitive resin composition, film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device
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Application No.: US14904145Application Date: 2013-07-16
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Publication No.: US10428253B2Publication Date: 2019-10-01
- Inventor: Tomonori Minegishi , Kazuyuki Mitsukura
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd
- Current Assignee: Hitachi Chemical Company, Ltd
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery LLP
- International Application: PCT/JP2013/069303 WO 20130716
- International Announcement: WO2015/008330 WO 20150122
- Main IPC: C09J179/08
- IPC: C09J179/08 ; G03F7/027 ; G03F7/037 ; G03F7/038 ; G03F7/075 ; H01L23/00 ; C09J7/20
Abstract:
The present invention provides a photosensitive resin composition comprising: an alkali-soluble resin having a phenolic hydroxyl group as an end group (A); a radiation-polymerizable compound (B); and a photoinitiator (C), a film adhesive, an adhesive sheet, an adhesive pattern, a semiconductor wafer with an adhesive layer, and a semiconductor device using the photosensitive resin composition.
Public/Granted literature
Information query
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