Invention Grant
- Patent Title: Method for modifying an electrically conductive oxide surface, use for electrodeposition of copper on said surface
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Application No.: US15488056Application Date: 2017-04-14
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Publication No.: US10428435B2Publication Date: 2019-10-01
- Inventor: Yoan Bourlier , Thomas Berthelot
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1653345 20160415
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D5/00 ; C25D5/02 ; H01L31/0224 ; C25D7/12 ; C25C5/02 ; C25D5/38
Abstract:
The present invention relates to a method for modifying the surface of a substrate made of electrically conductive metal oxide and notably made of ITO, comprising the following steps consisting in: (i) bringing into contact said surface with a solution containing copper ions (Cu2+) and ammonia then washing and optionally drying the surface thus obtained; and (ii) bringing into contact the surface obtained following step (i) with a solution containing sodium tetraborohydride then washing and optionally drying the surface of said conductive metal oxide substrate. The present invention relates to the use of such a method within the scope of the metallization by copper of a conductive metal oxide substrate as well as the surfaces of a modified and metallized conductive metal oxide substrate thus obtained.
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