A system for measuring and mapping sheet resistivity of the film on flat-panel has a frame, a collection of leveling chucks, a probe-mounting assembly, and a collection of four-point probes. The probe-mounting assembly is a frame that holds the four-point probes in place. The leveling chucks and the probe-mounting assembly are mounted onto the frame, within the probe chamber. The flat panel is positioned in between the probe-mounting assembly and the leveling chucks. The sheet resistivity measurement by each of the collection of four-point probes can be done by electrical switching instead of mechanical repositioning and the flat panel transportation to and from the measurement position only needs to be done in one round trip instead of two, thus much time is saved. Also, the leveling chuck's speed in pressing the flat panel against the collection of four-point probes can be well controlled to avoid damaging of the flat panel.