A rotating or tilting MEMS structure, such as a tilt mirror for an optical device, includes a damping mechanism, provided by locating an inlay block structure underneath the MEMS rotating surface. Damping is created by the temporary squeezing or compression of the air, atmosphere, or gas(es) surrounding the MEMS structure, between the underside of the MEMS tilting surface and the top surface of the block. Movement of the MEMS surface away from the top surface of the block will also be damped by the temporary reduction in pressure. The block structure is fabricated separately from the MEMS tilt-mirror structure and located under the MEMS tilt-mirror structure, either before or during the die-attach or die-bonding process. The damping effect serves to minimize and limit the amplitude and duration of oscillatory motion of the MEMS tilt-mirror, following intentional movement of the mirror, or, in response to external shock and vibrational forces.