Invention Grant
- Patent Title: Imaging module and endoscope
-
Application No.: US15286690Application Date: 2016-10-06
-
Publication No.: US10429633B2Publication Date: 2019-10-01
- Inventor: Takeshi Ishizuka , Hideaki Usuda
- Applicant: FUJIKURA LTD.
- Applicant Address: JP Koto-ku, Tokyo
- Assignee: FUJIKURA LTD.
- Current Assignee: FUJIKURA LTD.
- Current Assignee Address: JP Koto-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2015-234029 20151130
- Main IPC: G02B23/24
- IPC: G02B23/24 ; H01R13/405 ; H01R24/38 ; H04N5/225

Abstract:
An imaging module of the invention includes: a connector including: a first implanted conductor; a second implanted conductor longer than the first implanted conductor; a first groove that includes a second mounting terminal constituting part of the first implanted conductor; a second groove that includes a third mounting terminal constituting part of the second implanted conductor; and a third groove that is located between the first groove and the second groove; and a coaxial cable including: an internal conductor that is provided in the first groove and is electrically connected to the second mounting terminal; a sheath conductor that is provided in the second groove and is electrically connected to the third mounting terminal; and a coated portion that is provided in the third groove.
Public/Granted literature
- US20170153441A1 IMAGING MODULE AND ENDOSCOPE Public/Granted day:2017-06-01
Information query