Invention Grant
- Patent Title: Compound for forming organic film, composition for forming organic film, method for forming organic film, and patterning process
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Application No.: US15359323Application Date: 2016-11-22
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Publication No.: US10429739B2Publication Date: 2019-10-01
- Inventor: Daisuke Kori , Tsutomu Ogihara , Takeru Watanabe , Yoshinori Taneda , Rie Kikuchi
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2015-251955 20151224
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/32 ; G03F7/09 ; G03F7/039 ; C09D149/00 ; C09D165/00 ; G03F7/20 ; H01L21/02 ; G03F7/16 ; H01L21/027 ; H01L21/3105 ; C09D155/00 ; C08G8/08 ; G03F7/075 ; H01L21/033
Abstract:
The present invention provides a compound for forming an organic film which has a minimum complex viscosity of 10 Pa·s or less when the complex viscosity is measured within a range of 50° C. to 300° C. This compound for forming an organic film can provide an organic film composition having high filling and planarizing properties.
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