Invention Grant
- Patent Title: Multi-layer antenna
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Application No.: US15692995Application Date: 2017-08-31
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Publication No.: US10430784B1Publication Date: 2019-10-01
- Inventor: Yuchu He , Afshin Rezayee , Haipeng Yan , Emad Bidari
- Applicant: Square, Inc.
- Applicant Address: US CA San Francisco
- Assignee: Square, Inc.
- Current Assignee: Square, Inc.
- Current Assignee Address: US CA San Francisco
- Agency: Maynard Cooper & Gale, P.C.
- Agent Brian T. Sattizahn, Esq.
- Main IPC: H01Q1/30
- IPC: H01Q1/30 ; G06Q20/32 ; H04B5/00 ; H01Q1/38 ; H01Q1/22 ; H01Q21/22 ; H01Q1/32 ; H01Q7/00 ; H01Q3/30

Abstract:
A multi-layer antenna for near-field communications can have a first layer on a top surface of flexible circuit board and a second layer on a bottom surface of the flexible circuit board. The first layer and the second layer can be connected in series by a through connection in the flexible circuit board. The first layer can incorporate a single loop in the shape of a rectangle and the second layer can incorporate a single loop in the shape of a rectangle. The second layer of the antenna can be vertically aligned with the first layer of the antenna and can have current flow in the same direction as the first layer to provide for an increased magnetic flux from the antenna.
Information query