Invention Grant
- Patent Title: Electronic component and method for manufacturing electronic component
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Application No.: US15052438Application Date: 2016-02-24
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Publication No.: US10431365B2Publication Date: 2019-10-01
- Inventor: Hironobu Kubota , Mitsunori Inoue
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2015-042180 20150304; JP2015-239973 20151209
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F17/04 ; H01F27/29

Abstract:
An electronic component includes a main body made from a metal magnetic powder and an insulating resin, a coating film covering the surface of the main body, a conductor disposed inside the main body, inorganic particles adhering to the surface of the coating film, and outer electrodes which are electrically connected to the conductor and which cover portions of the surface of the coating film while inorganic particles adhere to the portions, wherein the coating film contains a resin and metal cations.
Public/Granted literature
- US20160260535A1 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT Public/Granted day:2016-09-08
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |