Invention Grant
- Patent Title: Coil electronic component and method of manufacturing the same
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Application No.: US15253130Application Date: 2016-08-31
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Publication No.: US10431368B2Publication Date: 2019-10-01
- Inventor: Woon Chul Choi , Ji Hye Oh , Jung Hyuk Jung , Han Wool Ryu
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2015-0189279 20151230
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/02 ; H01F27/245 ; H01F27/255 ; H01F41/02 ; H01F41/12 ; H01F41/16 ; H01F41/34
Abstract:
A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.
Public/Granted literature
- US20170194084A1 COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-07-06
Information query
