Invention Grant
- Patent Title: Electric field assisted placement of nanomaterials through dielectric engineering
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Application No.: US15362191Application Date: 2016-11-28
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Publication No.: US10431453B2Publication Date: 2019-10-01
- Inventor: Michael Engel , Mathias B. Steiner , Jaione Tirapu Azpiroz
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Grant Johnson
- Main IPC: H01L51/00
- IPC: H01L51/00 ; H01L21/02 ; H01L51/10 ; B82Y40/00

Abstract:
A method of positioning nanomaterials that includes forming a set of electrodes on a substrate, and covering the electrodes and substrate with a single layer of guiding dielectric material. The method may continue with patterning the guiding dielectric to provide dielectric guide features, wherein an exposed portion of the substrate between the dielectric guide features provides a deposition surface. A liquid medium containing at least one nanostructure is applied to the guiding dielectric features and the deposition surface. An electric field produced by the electrodes that is attenuated by the dielectric guide features creates an attractive force that guides the nanostructures to the deposition surface.
Public/Granted literature
- US20180151668A1 ELECTRIC FIELD ASSISTED PLACEMENT OF NANOMATERIALS THROUGH DIELECTRIC ENGINEERING Public/Granted day:2018-05-31
Information query
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