Invention Grant
- Patent Title: Semiconductor substrate and manufacturing method thereof
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Application No.: US16056545Application Date: 2018-08-07
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Publication No.: US10431454B2Publication Date: 2019-10-01
- Inventor: Fang-Chang Hsueh , Heng-Kuang Lin
- Applicant: Nuvoton Technology Corporation
- Applicant Address: TW Hsinchu
- Assignee: Nuvoton Technology Corporation
- Current Assignee: Nuvoton Technology Corporation
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW106127015A 20170810
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/20 ; H01L29/205 ; H01L33/00 ; H01L29/10 ; H01L29/778 ; H01L21/266 ; H01L21/265

Abstract:
A semiconductor substrate and a manufacturing method thereof are provided. The semiconductor substrate includes a base, a buffer layer, a mask layer and a first GaN layer. The buffer layer is disposed on the base, wherein doped regions are disposed in a portion of the surface of the buffer layer. The mask layer is disposed on the buffer layer and located on the doped regions. The first GaN layer is disposed on the buffer layer and covers the mask layer.
Public/Granted literature
- US20190051522A1 SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-02-14
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