Invention Grant
- Patent Title: Method of processing substrate and method of fabricating semiconductor device using the same
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Application No.: US15848896Application Date: 2017-12-20
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Publication No.: US10431506B2Publication Date: 2019-10-01
- Inventor: Dusik Bae , Yoonmi Lee , Hyeogki Kim , Kyoungsil Park , JungDae Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2017-0008219 20170117
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/311 ; G01N21/65 ; H01L21/67 ; H01L21/033 ; G01N21/956

Abstract:
Disclosed are a method of processing a substrate and a method of fabricating a semiconductor device using the same. The method of processing a substrate comprises forming a mask layer on a substrate, inspecting the mask layer, and forming a mask pattern based on an inspection result of the mask layer. The operation of inspecting the mask layer comprises using Raman spectrum analysis to detect defects in the mask layer.
Public/Granted literature
- US20180204777A1 METHOD OF PROCESSING SUBSTRATE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME Public/Granted day:2018-07-19
Information query
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