Invention Grant
- Patent Title: Methods and systems to improve printed electrical components and for integration in circuits
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Application No.: US15376729Application Date: 2016-12-13
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Publication No.: US10431508B2Publication Date: 2019-10-01
- Inventor: John L. Gustafson
- Applicant: VQ RESEARCH, INC.
- Applicant Address: US CA Palo Alto
- Assignee: VQ RESEARCH, INC.
- Current Assignee: VQ RESEARCH, INC.
- Current Assignee Address: US CA Palo Alto
- Agent Ricky Lam
- Main IPC: H01L23/055
- IPC: H01L23/055 ; H01L23/15 ; H01L23/00 ; H01L23/498 ; H01L21/48 ; H05K1/02 ; H01L23/60 ; H05K3/12 ; H05K3/22 ; G06F17/50 ; H01F27/28 ; H01F27/24 ; H01C7/18 ; H01G4/30 ; H01G4/005 ; H01G4/012 ; H01G4/232 ; H05K1/16 ; H01G4/12

Abstract:
Methods and systems to improve printed electrical components and for integration in circuits are disclosed. Passive components, e.g., capacitors, resistors and inductors, can be printed directly into a solid ceramic block using additive manufacturing. A grounded conductive plane or a conductive cage may be placed between adjacent electrical components, or around each component, to minimize unwanted parasitic effects in the circuits, such as, e.g., parasitic capacitance or parasitic inductance. Resistors may be printed in non-traditional shapes, for example, S-shape, smooth S-shape, U-shape, V-shape, Z-shape, zigzag-shape, and any other acceptable alternative configurations. The flexibility in shapes and sizes of the printed resistors allows optimal space usage of the ceramic block. The present invention also discloses an electrical component comprising combined predetermined values of capacitance, resistance and inductance. The integration and adjustability of a multi-property device can provide significant advantages in electronics manufacturing.
Public/Granted literature
- US20170092556A1 METHODS AND SYSTEMS TO IMPROVE PRINTED ELECTRICAL COMPONENTS AND FOR INTEGRATION IN CIRCUITS Public/Granted day:2017-03-30
Information query
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