Invention Grant
- Patent Title: Semiconductor packages having dual encapsulation material
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Application No.: US15818508Application Date: 2017-11-20
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Publication No.: US10431514B2Publication Date: 2019-10-01
- Inventor: David Bonnici , Brenda Farrugia
- Applicant: STMICROELECTRONICS (MALTA) LTD
- Applicant Address: MT Kirkop
- Assignee: STMicroelectronics (Malta) Ltd
- Current Assignee: STMicroelectronics (Malta) Ltd
- Current Assignee Address: MT Kirkop
- Agency: Seed Intellectual Property Law Group LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/31 ; H01L25/16 ; H01L23/00 ; H01L23/29 ; H01L21/56 ; H01L21/78 ; H01L31/0203 ; H01L31/02 ; H01L27/146 ; H01L33/56 ; H01L33/62
Abstract:
One or more embodiments are directed to a semiconductor package that includes transparent encapsulation material and an opaque encapsulation material. In one embodiment, the opaque encapsulation material is thicker than the transparent encapsulation material; however, the outer surfaces of the opaque and the transparent encapsulation materials are coplanar with each other.
Public/Granted literature
- US20190157176A1 SEMICONDUCTOR PACKAGES HAVING DUAL ENCAPSULATION MATERIAL Public/Granted day:2019-05-23
Information query
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