- Patent Title: Integrated electronic components and methods of formation thereof
-
Application No.: US15811038Application Date: 2017-11-13
-
Publication No.: US10431521B2Publication Date: 2019-10-01
- Inventor: Jean-Marc Rollin , David W. Sherrer
- Applicant: Nuvotronics, Inc
- Applicant Address: US CA San Diego
- Assignee: CUBIC CORPORATION
- Current Assignee: CUBIC CORPORATION
- Current Assignee Address: US CA San Diego
- Agency: Dann, Dorfman, Herrell & Skillman
- Agent Niels Haun
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01P3/06 ; H01P11/00 ; H05K1/02 ; H01L23/58 ; H01L23/528 ; H01L23/552 ; H01L23/00 ; H01L23/66 ; H05K3/40 ; H05K3/46
Abstract:
Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
Public/Granted literature
- US20180082923A1 INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF Public/Granted day:2018-03-22
Information query
IPC分类:
