Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16070352Application Date: 2016-02-08
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Publication No.: US10431528B2Publication Date: 2019-10-01
- Inventor: Takamasa Iwai , Satoshi Kondo , Hiroshi Kawashima , Junji Fujino , Ken Sakamoto
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2016/053671 WO 20160208
- International Announcement: WO2017/138072 WO 20170817
- Main IPC: H01L23/495
- IPC: H01L23/495

Abstract:
A leadframe of a semiconductor device includes a die pad, first and second suspension leads, and a frame. The main surfaces of the die pad and the frame are located on different planes, and the die pad and the frame are connected to each other by the first and second suspension leads. A first boundary line between the first suspension lead and the die pad runs on a straight line different from a second boundary line between the second suspension lead and the die pad. A third boundary line between the first suspension lead and the frame runs on a straight line different from a fourth boundary line between the second suspension lead and the frame.
Public/Granted literature
- US20190043788A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-02-07
Information query
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