Invention Grant
- Patent Title: Semiconductor device with notched main lead
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Application No.: US14708962Application Date: 2015-05-11
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Publication No.: US10431532B2Publication Date: 2019-10-01
- Inventor: Kota Ise
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2014-098522 20140512; JP2015-096271 20150511
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31 ; H01L23/00
Abstract:
A semiconductor device is provided with a semiconductor element, a main lead on which the semiconductor element is disposed, and a resin package that covers the semiconductor element and the main lead. A notch that is recessed toward the center of the main lead in plan view as seen in the thickness direction of the semiconductor element is formed in the main lead.
Public/Granted literature
- US20150325504A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-11-12
Information query
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