Invention Grant
- Patent Title: Electronic package and method for fabricating the same
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Application No.: US15680515Application Date: 2017-08-18
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Publication No.: US10431535B2Publication Date: 2019-10-01
- Inventor: Jui-Feng Chen , Chia-Cheng Hsu , Wen-Jung Tsai , Chia-Cheng Chen , Cheng Kai Chang
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW106114244A 20170428
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L29/40 ; H01L23/498 ; H01L23/48 ; H01Q1/22
Abstract:
An electronic package and a method for fabricating the same are provided. The method includes forming an antenna structure in contact with one side of a circuit structure of a packaging substrate, and disposing an electronic component on the other side of the circuit structure. As such, the antenna structure is integrated with the packaging substrate, thereby reducing the thickness of the electronic package and improving the efficiency of the antenna structure.
Public/Granted literature
- US20180316083A1 ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2018-11-01
Information query
IPC分类:
