Invention Grant
- Patent Title: Transistor packages
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Application No.: US15640117Application Date: 2017-06-30
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Publication No.: US10431538B2Publication Date: 2019-10-01
- Inventor: David M. Kucharski , John A. Dickey
- Applicant: Hamilton Sundstrand Corporation
- Applicant Address: US NC Charlotte
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US NC Charlotte
- Agency: Locke Lord LLP
- Agent Scott D. Wofsy; Alicia J. Carroll
- Main IPC: H01L23/50
- IPC: H01L23/50 ; H01L23/057 ; H01L23/498

Abstract:
In accordance with another aspect, a power switch assembly includes a transistor package including a die case, a source bus tab extending from a first side of the die case, a drain bus tab extending from a second side of the die case, a first power bus rail operatively connected to the source bus tab of the transistor package and a second power bus rail operatively connected to the drain bus tab of the transistor package.
Public/Granted literature
- US20190006273A1 TRANSISTOR PACKAGES Public/Granted day:2019-01-03
Information query
IPC分类: