Invention Grant
- Patent Title: Structure and formation method of chip package structure
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Application No.: US14539180Application Date: 2014-11-12
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Publication No.: US10431564B2Publication Date: 2019-10-01
- Inventor: Tzu-Hung Lin
- Applicant: MediaTek inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L23/36
- IPC: H01L23/36 ; H01L25/00 ; H01L25/065 ; H01L23/367 ; H01L23/498 ; H01L23/373 ; H01L23/00 ; H01L23/31 ; H01L25/10
Abstract:
A chip package structure and a method for forming a chip package are provided. The chip package structure includes a chip package over a printed circuit board and multiple conductive bumps between the chip package and the printed circuit board. The chip package structure also includes one or more thermal conductive elements between the chip package and the printed circuit board. The thermal conductive element has a thermal conductivity higher than a thermal conductivity of each of the conductive bumps.
Public/Granted literature
- US20150214192A1 STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE Public/Granted day:2015-07-30
Information query
IPC分类:
