Invention Grant
- Patent Title: Complementary metal-oxide semiconductor (CMOS) integration with compound semiconductor devices
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Application No.: US15966225Application Date: 2018-04-30
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Publication No.: US10431581B1Publication Date: 2019-10-01
- Inventor: Xia Li , Gengming Tao , Bin Yang
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Patterson & Sheridan, L.L.P
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L27/092 ; H01L29/205 ; H01L29/225 ; H01L21/8249 ; H01L29/66 ; H01L21/8238 ; H01L29/737

Abstract:
Certain aspects of the present disclosure provide a semiconductor device. One example semiconductor device generally includes a substrate, a well region disposed adjacent to the substrate, a first fin disposed above the well region, a second fin disposed above the substrate, and a gate region disposed adjacent to each of the first fin and the second fin. The semiconductor device may also include at least one third fin disposed above the substrate, a support layer disposed above the at least one third fin, and a compound semiconductor device disposed above the support layer.
Information query
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