Invention Grant
- Patent Title: RF electronic circuit comprising cavities buried under RF electronic components of the circuit
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Application No.: US15487865Application Date: 2017-04-14
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Publication No.: US10431597B2Publication Date: 2019-10-01
- Inventor: Lucile Arnaud
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neusdadt, L.L.P.
- Priority: FR1653449 20160419
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/306 ; H01L23/60 ; H01L21/762
Abstract:
An RF electronic circuit comprising at least: a substrate comprising at least one support layer and a semiconducting surface layer located on the support layer; at least one electronic component able to carry out at least one of the RF signal transmission and/or reception and/or processing functions, and made in or on a first region of the surface layer; and a matrix of cavities located in at least one first region of the support layer located under the first region of the surface layer, facing at least the electronic component, and such that the internal volumes of the cavities are separated and isolated from each other by portions of the support layer.
Public/Granted literature
- US20170301693A1 RF ELECTRONIC CIRCUIT COMPRISING CAVITIES BURIED UNDER RF ELECTRONIC COMPONENTS OF THE CIRCUIT Public/Granted day:2017-10-19
Information query
IPC分类:
