Invention Grant
- Patent Title: Electronic devices having spiral conductive structures
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Application No.: US15911626Application Date: 2018-03-05
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Publication No.: US10431646B2Publication Date: 2019-10-01
- Inventor: Peng Xu , Kangguo Cheng , Xuefeng Liu , Chi-Chun Liu , Yongan Xu
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L21/3105 ; H01L23/522

Abstract:
Techniques for generating enhanced inductors and other electronic devices are presented. A device generator component (DGC) performs directed-self assembly (DSA) co-polymer deposition on a circular guide pattern formed in low-k dielectric film, and DSA annealing to form two polymers in the form of alternating concentric rings; performs a loop cut in the concentric rings to form concentric segments; fills the cut portion with insulator material; selectively removes first polymer, fills the space with low-k dielectric, and planarizes the surface; selectively removes the second polymer, fills the space with conductive material, and planarizes the surface; deposits low-k film on top of the concentric segments and insulator material that filled the loop cut portion; forms vias in the low-k film, wherein each via spans from an end of one segment to an end of another segment; and fills vias with conductive material to form conductive connectors to form substantially spiral conductive structure.
Public/Granted literature
- US20190273127A1 ELECTRONIC DEVICES HAVING SPIRAL CONDUCTIVE STRUCTURES Public/Granted day:2019-09-05
Information query
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