Invention Grant
- Patent Title: Trench-based diode and method for manufacturing such a diode
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Application No.: US15450168Application Date: 2017-03-06
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Publication No.: US10431653B2Publication Date: 2019-10-01
- Inventor: Alfred Goerlach
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Norton Rose Fulbright US LLP
- Agent Gerard Messina
- Priority: DE102016204250 20160315
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/861 ; H01L29/47 ; H01L29/16 ; H01L29/66 ; H01L21/02

Abstract:
A semiconductor system including a planar anode contact, a planar cathode contact, and a volume of n-conductive semiconductor material, which has an anode-side end and a cathode-side end and extends between the anode contact and the cathode contact. A p-conductive area extends from the anode-side end of the volume toward the cathode-side end of the volume without reaching the cathode-side end. The p-conductive area has two sub-areas which are separated from one another in a cross section lying transversely with respect to the anode contact and the cathode contact, which delimit a sub-volume of the volume filled with n-conductive semiconductor material. The sub-volume is open toward the cathode contact, and is delimited by cathode-side ends of the sub-areas. A distance of the two sub-areas defining the opening is smaller than a distance between the two sub-areas prevailing outside of the opening and lying between anode side ends of the sub-areas.
Public/Granted literature
- US20170271444A1 TRENCH-BASED DIODE AND METHOD FOR MANUFACTURING SUCH A DIODE Public/Granted day:2017-09-21
Information query
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