Invention Grant
- Patent Title: Semiconductor device and method for forming the same
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Application No.: US15942568Application Date: 2018-04-01
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Publication No.: US10431679B2Publication Date: 2019-10-01
- Inventor: Feng-Yi Chang , Yu-Cheng Tung , Fu-Che Lee
- Applicant: UNITED MICROELECTRONICS CORP. , Fujian Jinhua Integrated Circuit Co., Ltd.
- Applicant Address: TW Hsin-Chu CN Quanzhou, Fujian Province
- Assignee: UNITED MICROELECTRONICS CORP.,Fujian Jinhua Integrated Circuit Co., Ltd.
- Current Assignee: UNITED MICROELECTRONICS CORP.,Fujian Jinhua Integrated Circuit Co., Ltd.
- Current Assignee Address: TW Hsin-Chu CN Quanzhou, Fujian Province
- Agent Winston Hsu
- Priority: CN201710385077 20170526
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L29/78 ; H01L21/4757 ; H01L21/02 ; H01L21/762 ; H01L27/108 ; H01L29/66 ; H01L29/423

Abstract:
A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a substrate and at least a gate trench extending along a first direction formed in the substrate. A gate dielectric layer is formed conformally covering the gate trench. A gate metal is formed on the gate dielectric layer and filling the gate trench. A plurality of intervening structures are arranged along the first direction in a lower portion of the gate trench and disposed between the gate metal and the gate dielectric layer.
Public/Granted literature
- US20180342613A1 SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME Public/Granted day:2018-11-29
Information query
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