Invention Grant
- Patent Title: Preparation methods for semiconductor layer and TFT, TFT and array substrate comprising semiconductor layer
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Application No.: US15533128Application Date: 2016-05-20
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Publication No.: US10431692B2Publication Date: 2019-10-01
- Inventor: Hu Meng
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Calfee, Halter & Griswold LLP
- Priority: CN201610128473 20160307
- International Application: PCT/CN2016/082771 WO 20160520
- International Announcement: WO2017/152500 WO 20170914
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L27/32 ; H01L29/66 ; H01L51/05 ; H01L51/00 ; H01L29/08 ; H01L35/24 ; H01L29/786 ; H01L29/417 ; H01L29/423 ; H01L29/45 ; H01L29/49

Abstract:
Embodiments of the present disclosure provide preparation methods for a semiconductor layer and a TFT, a TFT and an array substrate. The preparation method for a semiconductor layer includes forming a silicon dioxide film on a substrate; forming sidewalls at two ends of the semiconductor layer to be formed by patterning process; performing amination treatment on the sidewalls so that an aminosiloxane monolayer self-assembly is formed on the surface of the sidewalls; carboxylating a carbon nanotube solution and making the carboxylated carbon nanotube solution on the surface of the substrate with the sidewalls formed to form a carbon nanotube film; removing portions of the carbon nanotube film other than the portion between the sidewalls to form a semiconductor layer.
Public/Granted literature
- US20180108783A1 PREPARATION METHODS FOR SEMICONDUCTOR LAYER AND TFT, TFT, ARRAY SUBSTRATE Public/Granted day:2018-04-19
Information query
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