Invention Grant
- Patent Title: Conductive paste composition for providing enhanced adhesion strength to a semiconductor substrate and its use
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Application No.: US15920940Application Date: 2018-03-14
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Publication No.: US10431700B2Publication Date: 2019-10-01
- Inventor: Po-Yang Shih , Yu-Shuo Yang , Pi-Yu Hsin
- Applicant: GIGA SOLAR MATERIALS CORP.
- Applicant Address: TW Hsinchu County
- Assignee: Giga Solar Materials Corp.
- Current Assignee: Giga Solar Materials Corp.
- Current Assignee Address: TW Hsinchu County
- Agency: Rosenberg, Klein & Lee
- Main IPC: H01L31/0224
- IPC: H01L31/0224 ; H01B1/22 ; H01L31/0216 ; C09D5/24 ; C09D101/28 ; C09D7/61 ; C09D5/00 ; C08K3/22 ; C08K3/08 ; C08K3/40
Abstract:
The present invention relates to a conductive paste, which imparts an electrode formed therefrom with enhanced adhesion strength to a semiconductor substrate by incorporation of LiAlO2 (lithium aluminate) therein. The present invention further relates to an electrode formed from the conductive paste and a semiconductor and in particular, a solar cell comprising the electrode produced therefrom.
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