Invention Grant
- Patent Title: Nitride underlayer and fabrication method thereof
-
Application No.: US15859493Application Date: 2017-12-30
-
Publication No.: US10431713B2Publication Date: 2019-10-01
- Inventor: Wen-yu Lin , Shengchang Chen , Zhibai Zhong , Chen-ke Hsu
- Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Xiamen
- Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Xiamen
- Agency: Syncoda LLC
- Agent Feng Ma
- Priority: CN201510921684 20151214
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L21/00 ; H01L33/00 ; H01L33/12 ; C23C14/06 ; C23C14/58 ; C23C16/02 ; C23C28/04 ; H01L21/02 ; C23C14/34 ; C23C16/30 ; H01L33/32

Abstract:
A nitride underlayer structure includes a sputtered AlN buffer layer with open band-shaped holes, thus providing a stress release path before the nitride film is grown over the buffer layer. A light-emitting diode with such nitride underlayer structure has improved lattice quality of the nitride underlayer structure and the problem of surface cracks is resolved. A fabrication method of the nitride underlayer includes providing a substrate and forming a band-shaped material layer over the substrate; sputtering an AlN material layer over the band-shaped material layer and the substrate to form a flat film; scanning back and forth from the substrate end with a laser beam to decompose the band-shaped material layer to form a sputtered AlN buffer layer with flat surface and band-shaped holes inside; and forming an AlxIn1-x-yGayN layer (0≤x≤1, 0≤y≤1) over the sputtered AlN buffer layer.
Public/Granted literature
- US20180122635A1 Nitride Underlayer and Fabrication Method Thereof Public/Granted day:2018-05-03
Information query
IPC分类: