Invention Grant
- Patent Title: Method for manufacturing busbar modules
-
Application No.: US15381425Application Date: 2016-12-16
-
Publication No.: US10431800B2Publication Date: 2019-10-01
- Inventor: Katsunori Sato , Yutaro Okazaki
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2015-248012 20151218
- Main IPC: H01M2/20
- IPC: H01M2/20 ; H01M2/22 ; H01R43/16 ; H01M2/10

Abstract:
A method for manufacturing busbar modules that includes placing a plurality of first linear conductors on one side and a plurality of second linear conductors on the other side across a long planar conductor, extruding an insulating cover material to cover the first linear conductors and join the first linear conductors to the planar conductor with the insulating cover material and to cover the second linear conductors and join the second linear conductors to the planar conductor with the insulating cover material, cutting the planar conductor along first, second and third cutting lines, forming a first busbar module by joining the first linear conductors and the plurality of busbars, and forming a second busbar module by joining the second linear conductors and the plurality of busbars.
Public/Granted literature
- US20170179459A1 METHOD FOR MANUFACTURING BUSBAR MODULES AND METHOD FOR MANUFACTURING BATTERY PACK Public/Granted day:2017-06-22
Information query