• Patent Title: Non-reciprocal circuit element and wireless communication device
  • Application No.: US15735459
    Application Date: 2016-06-14
  • Publication No.: US10431864B2
    Publication Date: 2019-10-01
  • Inventor: Yusuke Kimata
  • Applicant: NEC Corporation
  • Applicant Address: JP Minato-ku, Tokyo
  • Assignee: NEC CORPORATION
  • Current Assignee: NEC CORPORATION
  • Current Assignee Address: JP Minato-ku, Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2015-141343 20150715
  • International Application: PCT/JP2016/002868 WO 20160614
  • International Announcement: WO2017/010039 WO 20170119
  • Main IPC: H01P1/387
  • IPC: H01P1/387 H01Q1/50 H04B1/40
Non-reciprocal circuit element and wireless communication device
Abstract:
The present surface mount technology non-reciprocal circuit element (1) includes a ferromagnetic material (14) placed above a circuit board (11), and a conductor cover (13). The conductor cover (13) is composed of a main unit (12) located above the ferromagnetic material (14) and connecting members (17_1, 17_2, 17_3) for electrically connecting the main unit (12) with transmission lines (18_1, 18_2, 18_3) on the circuit board (11), respectively. The ferromagnetic material (14) and at least one of the connecting members (17_1, 17_2, 17_3) are formed so as to create, in at least one of gaps between the side surface of the ferromagnetic material (14) and each of the connecting members (17_1, 17_2, 17_3), a location where a clearance between a side surface of the ferromagnetic material (14) and the connecting member is a first clearance and a location where it is a second clearance different from the first clearance.
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