An electrical component socket includes a socket body arranged on a circuit board and including a receiving portion configured to receive an electrical component. The socket body includes an arrangement portion in which a row of contact pins to be in contact with leads of an IC package is arranged. At least one of these contact pins and another one of the contact pins adjacent to the at least one of the contact pins have an arrangement pitch that is narrower than a pitch between the terminals of the electrical component, and the other one of the contact pins and still another one of the contact pins adjacent to the other one of the contact pins have an arrangement pitch that is substantially equal to the pitch between the terminals of the electrical component.