Invention Grant
- Patent Title: Systems and methods for quartz wafer bonding
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Application No.: US14841314Application Date: 2015-08-31
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Publication No.: US10432168B2Publication Date: 2019-10-01
- Inventor: Christopher James Kapusta , Marco Francesco Aimi
- Applicant: GENERAL ELECTRIC COMPANY
- Applicant Address: US NY Niskayuna
- Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee Address: US NY Niskayuna
- Agency: Fletcher Yoder, P.C.
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/10 ; H03H9/19 ; H03H3/08 ; H03H9/05 ; G01L3/10 ; G01L1/16 ; H03H3/04
Abstract:
In one embodiment, a bonded quartz wafer package includes a first quartz wafer including at least one quartz-based device, a second quartz wafer disposed above the first quartz wafer, and a liquid crystal polymer (LCP) bonding layer disposed in between the first and second quartz wafers that bonds the first and second quartz wafers together.
Public/Granted literature
- US20170063326A1 SYSTEMS AND METHODS FOR QUARTZ WAFER BONDING Public/Granted day:2017-03-02
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