Invention Grant
- Patent Title: Microphone with hydrophobic ingress protection
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Application No.: US16063218Application Date: 2016-12-01
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Publication No.: US10433071B2Publication Date: 2019-10-01
- Inventor: Sagnik Pal , Sung Bok Lee
- Applicant: Knowles Electronics, LLC
- Applicant Address: US IL Itasca
- Assignee: Knowles Electronics, LLC
- Current Assignee: Knowles Electronics, LLC
- Current Assignee Address: US IL Itasca
- Agency: Foley & Lardner LLP
- International Application: PCT/US2016/064354 WO 20161201
- International Announcement: WO2017/105851 WO 20170622
- Main IPC: H04R19/00
- IPC: H04R19/00 ; H04R19/04 ; B32B3/30 ; B81B3/00 ; H04R31/00 ; B81B7/00 ; H04R1/04

Abstract:
A microphone includes a base with a port extending therethrough, and a microelectromechanical system (MEMS) device coupled to the base. The MEMS device includes a diaphragm, a back plate, and a substrate. The substrate forms a back-hole. A capillary structure is disposed in the back-hole of the substrate, the cover, adjacent to the MEMS, or combinations thereof. The capillary structure includes a plurality of capillaries extending through the capillary structure. The capillary structure may have at least one hydrophobic surface and is configured to inhibit contaminants from outside the microphone from reaching the diaphragm via the port. In some embodiments, the capillary structure may protect against EMI.
Public/Granted literature
- US20180376254A1 MICROPHONE WITH HYDROPHOBIC INGRESS PROTECTION Public/Granted day:2018-12-27
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