The printed circuit board with at least one substrate layer having signal lines on a corresponding upper surface and on a corresponding lower surface has a sleeve-sized conductive layer on a circumference of at least one via hole between the upper and lower surface for a conductive connection between at least one signal line on the upper surface and at least one signal line on the lower surface. An axial enlargement of the sleeve-sized conductive layer is radially bent above a base layer of copper on the upper surface and below a base layer of copper on the lower surface.